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FLX-2320-S
Stress Measurement System
- Provides accurate stress measurements on various films and substrate
- Precisely determines and analyzes surface stress on deposited thin films
- Ideal for research and development purposes
- Resolving problems such as metal and dielectric film cracking, voiding, and lifting formation
- Equipped with a heating element for stress monitoring at high temperatures
- Optional cooling unit that allows a thorough understanding of film properties at temperatures from –65°C to 500°C
- Inert flush capability offers a controlled atmosphere in nitrogen or argon, preventing oxidation and moisture effects
Comprehensive Stress Measurement Solution
Thermal Process Development
A key FLX-2320-S feature is its ability to produce stress temperature correlations. In-situ stress measurements can be made from -65°C to 500°C at heating rates up to 30°C per minute (the cooling unit to -65°C is optional). An understanding of stress variations with temperature is essential for characterizing material properties such as stress relaxation, moisture evolution, and phase changes. In turn, this helps monitor and control process parameters such as sputtering power, furnace temperature, and gas flow rate.
Advanced Laser Technology
The FLX-2320-S features KLA-Tencor's patented dual wavelength technology, which enables the system to select the wavelength most suitable for the particular application. Pre-selecting the optimal wavelength minimizes destructive interference patterns from transparent films such as silicon nitride. In addition, the laser assembly has only a single moving component ensuring low vibration and high accuracy.
Comprehensive Data Analysis
The intuitive, Windows-based analysis software displays any combination of stress, time, surface deflection, or reflected light intensity measurements.
SPECIFICATIONS:
Download a FLX-2320 PDF Specifications Document
FLX-2320 Specifications Document
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